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Failure mechanisms in peeling of pressure‐sensitive adhesive tape
Author(s) -
Aubrey D. W.,
Welding G. N.,
Wong T.
Publication year - 1969
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1969.070131014
Subject(s) - adhesive , materials science , composite material , polyester , dissipation , pressure sensitive , slip (aerodynamics) , deformation (meteorology) , thermodynamics , physics , layer (electronics)
Studies on the peel behavior of pressure‐sensitive tape comprising a polyester backing and polyacrylate adhesive have shown that, in peeling from a plane glass surface, three fundamentally different modes of peeling may be distinguished, depending upon the rate of pulling. At low rates, deformation by flow of the adhesive appears to determine the peel behavior and the peel force is strongly rate dependent. At high rates, little or no viscous deformation of the adhesive occurs and the peel force is independent of rate. At intermediate pulling rates, cyclical instability of made of failure involving alternate storage and dissipation of elastic energy in the backing, results in the phenomenon of “slip‐stick” peeling, in which failure is jerky and regular. Results have been obtained which show how the pulling rates at which transitions from one mode of peel to another occur, and the peel force values for a given type of failure, depend upon such factors as molecular weight of adhesive, thickness of backing film, and angle of peeling.