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Thermal degradation of phenolic resins. V
Author(s) -
Learmonth G. S.,
Searle D. P.
Publication year - 1969
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1969.070130304
Subject(s) - phenol , degradation (telecommunications) , methylene bridge , chemistry , bisphenol a , phenols , cresol , methylene , organic chemistry , polymer chemistry , materials science , epoxy , telecommunications , computer science
The effect of varying the nature of crosslinks in phenolic resins has bee studied with the use of resins made from phenol, p ‐cresol, and bisphenol A. Thermal analysis showed that the methylene bridge was stronger under nonoxidative conditions than the isopropylidene linkage. The result is somewhat affected by the degree of crosslinking.