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Synthesis and polymerization of tris(alkylamino)‐silance with epoxy prepolymers
Author(s) -
Bilow N.,
Murphy R. F.,
Patterson W. J.
Publication year - 1967
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1967.070111103
Subject(s) - silane , epoxy , dielectric , curing (chemistry) , materials science , polymerization , dissipation factor , composite material , polymer chemistry , moisture , polymer , optoelectronics
Phenyltris(methylamino)silane, phenyltris(ethylamino)silane, and vinyltris(hexylamino)silane were synthesized and evaluated as curing agents for epoxy resins. Cured resins derived therefrom have very good physical and dielectric properties. The moisture resistance of the resins evaluated was especially good for those derived from the vinyltris(hexylamino)silane. Typical dielectric properties of a phenyltris(ethylamino)silane‐cured epoxy specimen include a dielectric constant of 3.7 at 25°C. and a dissipation factor of 0.8%. Elevated temperature data are also presented.