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Polymerization behavior of silver‐filled epoxy resins by resistivity measurements
Author(s) -
Miller B.
Publication year - 1966
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1966.070100204
Subject(s) - epoxy , electrical resistivity and conductivity , isothermal process , materials science , electrical conductor , polymerization , activation energy , composite material , adhesive , polymer chemistry , polymer , chemistry , thermodynamics , physics , layer (electronics) , electrical engineering , engineering
The cure of heavily silver‐loaded epoxy resins with several amines has been investigated by resistivity–time measurements under isothermal conditions. For favorable cases activation energies in the range of 14–17 kcal./mole have been derived from slope analyses of the ρ−t plots. The relationship of the technique to similar measurements on unfilled or lightly loaded resins is discussed. Many aspects of the electrical behavior of silver‐based conductive adhesive systems are clarified by the kinetic data.