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Adhesive properties of polyisophthalamides
Author(s) -
Gorton B. S.
Publication year - 1965
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1965.070091122
Subject(s) - adhesive , diamine , materials science , plasticizer , epoxy , polymer chemistry , polyamide , polymer , composite material , layer (electronics)
Poly(hexamethylene isophthalamide) was shown to possess good adhesive properties at temperatures up to 100°C. and under wet conditions. Poly(hexamethylene isophthalamide) was blended with both epoxy resins and plasticizers to give adhesive joints with strengths greater than that of the unmodified polymer. The adhesive bond strengths of the aromatic polyamides to aluminum in homologous series of poly(alkylene isophthalamide) increased with increasing diamine chain length.