Premium
Study of polymers applicable to insulation systems
Author(s) -
Torossian K. A.,
Jones S. L.
Publication year - 1964
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1964.070080132
Subject(s) - thermosetting polymer , materials science , composite material , polymer , thermal stability , dielectric strength , dielectric , thermal insulation , engineering , optoelectronics , layer (electronics) , chemical engineering
In recent years thermosetting polymeric systems have been used extensively as binders in electrical insulation and composite plastic structures with excellent success. However, such properties as post‐cure gassing, thermal stability, and high temperature bond strength have always been stumbling blocks for the insulation engineer. Experience has shown that these properties can ultimately affect the dielectric endurance of an insulation when subjected to high voltage stresses. The above‐mentioned problems are generally controlled by the organic binders present in the insulation. Test methods have been developed whereby the behavior of the polymers under certain conditions can be predicted, thus increasing the effectiveness of the design engineer.