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Process control considerations for adhesive bonding in production
Author(s) -
Bandaruk William
Publication year - 1962
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1962.070062016
Subject(s) - adhesive , reliability (semiconductor) , process (computing) , production (economics) , quality (philosophy) , process engineering , adhesive bonding , process control , computer science , reliability engineering , materials science , manufacturing engineering , engineering , composite material , power (physics) , philosophy , physics , epistemology , layer (electronics) , quantum mechanics , economics , macroeconomics , operating system
A system by which adhesive bonding would be best applied to production on ordnance items has been presented. In this system, process controls must be established. Significant and meaningful process controls must be selected and utilized toward producing the quality and reliability expected of the ordnance article.