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Adhesives in printed circuit applications
Author(s) -
Rider D. K.
Publication year - 1962
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1962.070062009
Subject(s) - adhesive , printed circuit board , materials science , computer science , 3d printed , nanotechnology , engineering , manufacturing engineering , layer (electronics) , operating system
This paper discusses the technology of adhesives employed in printed circuitry. The chemical types of adhesives are described and their general characteristics are given. Typical printed circuit processes are used to spotlight the demands placed on the adhesives. Test methods and requirements peculiar to printed circuitry are discussed in detail, and particular emphasis is placed on those properties which will not be too obvious to the adhesives technologist unfamiliar with circuitry. Secondary applications of adhesives in printed circuitry are touched on briefly, and mention is made of bonding methods in use or under development which do not employ adhesives. Numerous literature references are given.