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Novel formulations of high‐performance epoxy–amine networks based on the use of nanoscale phase‐separated antiplasticizers
Author(s) -
Sauvant Valérie,
Halary Jean Louis
Publication year - 2001
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1902
Subject(s) - epoxy , materials science , toughness , polymer , glass transition , monomer , relaxation (psychology) , phase (matter) , nanoscopic scale , modulus , molecule , amine gas treating , diamine , matrix (chemical analysis) , chemical engineering , composite material , polymer chemistry , chemistry , organic chemistry , nanotechnology , psychology , social psychology , engineering
The addition of an antiplasticizing agent in epoxy–amine resin formulations was revisited. The choice, as the antiplasticizer, of a chemical species which is fully miscible with the mixture of monomers but gives rise to nanoscale phase separation along the network construction was shown to be greatly favorable. Small domains, enriched in additive molecules, segregate in the polymer matrix, which is itself plasticized by residual additive molecules. Use of the additives did not change markedly the cure cycle and the total extent of reaction after full cure. The main effects of this special morphology on network properties were the depression of the glass transition temperature, T g , of the matrix and the appearance of some damping (so‐called μ‐relaxation) in the temperature range intermediate between the secondary relaxation and the main mechanical relaxation. Networks prepared in this way were shown (1) to save a sufficiently high value of T g in the view of the applications, (2) to present a higher modulus and higher toughness around room temperature than those of the conventional systems without an additive, and (3) to exhibit a lower water uptake at equilibrium than that of their regular homolog. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 759–774, 2001