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High‐performance bismaleimide resin film for resin film infusion
Author(s) -
Liang Guozheng,
Wang Dong
Publication year - 2001
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1741
Subject(s) - polyimide , materials science , composite material , composite number , resin composite , glass fiber , layer (electronics)
A novel high‐performance resin film, coded 4508B, suitable for the resin film infusion (RFI) process, was developed. It was prepared from 4,4′‐bismaleimidodiphenylmethane (BDM), o,o ′‐diallylbisphenol A (BA), polyethersulfone (PES), and polyimide (PI). The resin and its composite, reinforced by glass fiber cloth, were prepared and characterized in detail. The results showed that the resin film was stable at room temperature, its infusion temperature was 120°C, and the pot life was more than 60 min. In addition, the cured resin and the composite prepared by the RFI process had good thermal and mechanical properties and hot‐wet resistance. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2918–2922, 2001