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Crosslinkable positive‐tone photoresist comprising polymers with pendant carboxyl groups
Author(s) -
Liu JuiHsiang,
Shi ChihHung,
Chen WeTin
Publication year - 2001
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1523
Subject(s) - photoresist , methacrylic acid , polymer chemistry , thermostability , materials science , alicyclic compound , polymer , copolymer , diimide , resist , chemistry , organic chemistry , nanotechnology , composite material , molecule , layer (electronics) , enzyme , perylene
Poly(methacrylic acid‐co‐ t ‐butylmethacrylate‐co‐bornylmethacrylate) was synthesized and its application to a crosslinkable positive photoresist was investigated. The existence of pendant alicyclic bornyl groups increased the thermostability of copolymers; however, a decrease in the acid‐catalyzed deprotection of pendant t ‐butyl groups led to a decrease in the sensitivity of the positive‐tone photoresist. The thermostability of the relief polymeric patterns of the positive‐tone photoresist was appreciably improved effectively because of the acid‐catalyzed dehydration crosslinking of pendant carboxyl groups. Thermogravimetric properties of binder resins, exposure characteristics, and sensitivity and resolution of the photoresist were all investigated. Lithographic evaluation of the curable positive‐tone photoresists was also estimated. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 1014–1020, 2001