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Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA‐ODA) nanocomposites
Author(s) -
Jiang LiangYou,
Wei KungHwa
Publication year - 2004
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.13676
Subject(s) - polyimide , silicate , nanocomposite , copper , materials science , diffusion , transmission electron microscopy , secondary ion mass spectrometry , chemical engineering , polymer chemistry , composite material , ion , chemistry , nanotechnology , organic chemistry , layer (electronics) , metallurgy , physics , engineering , thermodynamics
Abstract The copper diffusion barrier properties of layered silicate/fluorinated polyimide nanocomposites were analyzed by transmission electron microscopy (TEM) and secondary ion mass spectrometry (SIMS). It was found that the particles of copper are effectively retarded from penetrating into the polyimide matrix by layered silicates. The diffusion coefficients of layered silicate/polyimide nanocomposites are lower than that of the pure polyimide. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 1422–1425, 2004