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Effect of filament temperature on the chemical vapor deposition of fluorocarbon–organosilicon copolymers
Author(s) -
Murthy Shashi K.,
Olsen Bradley D.,
Gleason Karen K.
Publication year - 2003
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.13342
Subject(s) - organosilicon , fluorocarbon , siloxane , materials science , chemical vapor deposition , protein filament , copolymer , polymer chemistry , thermal stability , polymer , chemical engineering , composite material , nanotechnology , engineering
The effect of filament temperature on the hot‐filament chemical vapor deposition (HFCVD) of fluorocarbon–organosilicon copolymer thin films from 1,3,5‐trivinyl‐1,3,5‐trimethylcyclotrisiloxane (V 3 D 3 ) and perfluorooctane sulfonyl fluoride (PFOSF) was examined. Significant changes in chemical structure occur as the filament temperature is varied, and these changes give rise to differences in thermal and mechanical properties. When the filament temperature is low, the films consist primarily of carbon‐backbone polymer chains with siloxane ring pendant groups. When higher filament temperatures are used, the film structure consists of siloxane‐backbone chains with some degree of crosslinking. Films produced with low filament temperatures have a greater degree of thermal stability and flexibility than those produced with high filament temperatures. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 2176–2185, 2004