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Nonisothermal fusion bonding in semicrystalline thermoplastics
Author(s) -
Plummer Christopher J. G.,
Bourban PierreEtienne,
Zanetto JeanEmile,
Smith Gregory D.,
Månson JanAnders E.
Publication year - 2002
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.11528
Subject(s) - materials science , crystallinity , polyamide , tacticity , composite material , phenomenological model , polypropylene , melting point , fusion , kinetics , isothermal process , activation energy , enthalpy of fusion , polymer , thermodynamics , chemistry , polymerization , linguistics , philosophy , physics , quantum mechanics
The development of the interfacial bond strength as a function of bonding conditions has been investigated in two representative semicrystalline thermoplastics, isotactic polypropylene and polyamide 12. If one side of the interface is well above the melting point immediately before contact, more rapid effective bonding is obtained for a given estimated interface temperature than under isothermal conditions. This is discussed in terms of a simple two‐parameter model for the critical strain energy release rate associated with crack propagation along the interface, which incorporates the rate of establishment of intimate contact at the interface. The model provides a self‐consistent phenomenological description of the time and temperature dependence of the bonding kinetics in polyamide 12 joints, although questions remain regarding the detailed mechanisms of bonding. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 87: 1267–1276, 2003