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Preparation and characterization of the copolymer containing N ‐pyridyl bi(methacryl)imide unit
Author(s) -
Li XinGui,
Huang MeiRong,
Shao HongTao
Publication year - 2002
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.11039
Subject(s) - imide , polymer chemistry , methacrylic acid , thermal decomposition , acid anhydride , materials science , copolymer , thermal stability , fourier transform infrared spectroscopy , chemistry , polymer , chemical engineering , organic chemistry , composite material , epoxy , engineering
The copolymer of methacrylic acid anhydride and N ‐2‐pyridyl bi(methacryl)imide was prepared based on the reaction of polymethacrylic acid with 2‐pyridylamine. The molecular structure was characterized by 1 H‐NMR, FTIR, UV–Vis, and circular dichroism techniques. The physical properties of polymethacrylic acid change significantly after an introduction of 6 mol % N ‐2‐pyridyl bi(methacryl)imide unit. In particular, the thermal degradation of the polymer was systematically studied in flowing nitrogen and air from room temperature to 800°C by thermogravimetry at a constant heating rate of 10°C/min. In both atmospheres, a four‐stage degradation process of the copolymer of methacrylic acid anhydride and N ‐2‐pyridyl bi(methacryl)imide was revealed. The initial thermal degradation temperature T d , and the first, second, and third temperatures at the maximum weight‐loss rate T dm 1 , T dm 2 , and T dm 3 all decrease with decreasing sample size or changing testing atmosphere from nitrogen to air, but the fourth temperature at the maximum weight‐loss rate T dm 4 increases. The maximum weight‐loss rate, char yield at elevated temperature, four‐stage decomposition process, and three kinetic parameters of the thermal degradation were discussed in detail. It is suggested that the copolymer of methacrylic acid anhydride and N ‐2‐pyridyl bi(methacryl)imide exhibits low thermal stability and multistage degradation characteristics. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1673–1678, 2002

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