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The properties of epoxy–imide resin cured by phosphorylated diamines containing different alkyl groups on phosphorus
Author(s) -
Yeh ChingFen,
Wang TsuiShuang,
Cherng JongYuh,
Kuo JungHua Steven,
Shau MinDa
Publication year - 2002
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.10903
Subject(s) - epoxy , curing (chemistry) , differential scanning calorimetry , imide , alkyl , thermogravimetric analysis , diamine , polymer chemistry , materials science , polymer , chemistry , organic chemistry , composite material , physics , thermodynamics
Cured networks of epoxy–imide resin cured with four types of phosphorylated diamine curing agents that contained different alkyl groups on phosphorus were studied. The structures of these novel phosphorus‐containing curing agents were confirmed by Mass, EA, IR, and 1 H‐NMR and 13 C‐NMR spectra characterization. The reactivities were measured by differential scanning calorimetry (DSC). It is found that the reactivities were not affected by the types of alkyl groups in the curing agents. In thermal gravimetric analysis (TGA), those polymers that were obtained through the curing reactions between epoxy–imide resin and four curing agents (BAMP, BAEP, BAPP, and BABP) also demonstrated excellent thermal properties as well as a high char yield. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 141–147, 2002