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The conductivity behavior of multi‐component epoxy, metal particle, carbon black, carbon fibril composites
Author(s) -
Jia W.,
Tchoudakov R.,
Joseph R.,
Narkis M.,
Siegmann A.
Publication year - 2002
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.10808
Subject(s) - epoxy , materials science , composite material , carbon black , curing (chemistry) , ethylene glycol , percolation threshold , conductivity , scanning electron microscope , nickel , differential scanning calorimetry , composite number , electrical resistivity and conductivity , chemical engineering , chemistry , natural rubber , metallurgy , electrical engineering , physics , engineering , thermodynamics
Following the previous studies of epoxy/silver conductive composites, a detailed investigation of the influence of ethylene glycol on the resulting resistivity of various composites was carried out. Ethylene glycol was found to have a catalytic effect on the curing process of the epoxy resin, verified by differential scanning calorimetry studies. The accelerated curing process diminishes settling of the metal particles and therefore results in better and more uniform conductivities. High temperature curing of the composites was found to have a similar effect on the conductivity. The conductivity behavior of some other composites, such as epoxy/nickel, epoxy/nickel/carbon fibrils, and epoxy/carbon black/carbon fibrils, were also studied. The structure–property relations were better understood through scanning electron microscopy observations. Silver and nickel particles were found to perform differently in the cured epoxy, showing different percolation concentrations and conductivity levels. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 1706–1713, 2002