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Removable foams based on an epoxy resin incorporating reversible Diels–Alder adducts
Author(s) -
Mcelha James R.,
Russick Edward M.,
Wheeler David R.,
Loy Douglas A.,
Aubert James H.
Publication year - 2002
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.10753
Subject(s) - epoxy , alder , materials science , diels–alder reaction , adduct , dissolution , rework , composite material , polymer chemistry , chemical engineering , polymer science , chemistry , organic chemistry , catalysis , ecology , engineering , biology
We have successfully incorporated Diels–Alder reversible chemistry into epoxy resins. The Diels–Alder chemistry goes in the forward direction at 60 °C and reverses at or above 90 °C. One resin was formulated with other commercial ingredients into foamed epoxy. The foam, shown to have mechanical properties similar to foams formed with conventional epoxy resins, is being utilized for electronic encapsulation. Because of the built‐in reversible chemistry, the foams can be easily removed by dissolution in 1‐butanol at 90 °C. Removal allows for the rework, upgrading, or dismantlement of the electronic components. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 1496–1502, 2002