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Thermal behavior of polyaniline films and polyaniline–polystyrene blends
Author(s) -
Jousseaume V.,
Morsli M.,
Bonnet A.
Publication year - 2002
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.10468
Subject(s) - polyaniline , materials science , thermogravimetric analysis , polystyrene , electrical resistivity and conductivity , seebeck coefficient , conductive polymer , evaporation , thermoelectric effect , polymer chemistry , doping , conductivity , polymer blend , chemical engineering , composite material , thermal conductivity , polymer , chemistry , thermodynamics , optoelectronics , copolymer , physics , electrical engineering , engineering , polymerization
In this article, a study of the thermal behavior of polyaniline films and polyaniline–polystyrene blends is presented. Transport measurements (electrical conductivity and thermoelectric power) at high temperature and thermogravimetric analysis show that an irreversible degradation is observed near 450 K for films doped with DiOHP and near 500 K for films doped with CSA. In both cases, the thermoelectric power is the most sensitive parameter to electrical degradation during the heating of conducting films. Electrical conductivity measurements during heating–cooling cycles show a diminution of the room temperature conductivity after evaporation of the solvent (water, m ‐cresol). A model of cluster with a variable diameter allows interpreting this phenomenon by assuming the existence of a sensitive frontier to the solvent at the periphery of conducting clusters. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1848–1855, 2002; DOI 10.1002/app.10468