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Plastic films with improved adhesion on integrated circuit packages for laser marking
Author(s) -
Tang Z. G.,
Ravi V.,
Zhao J. H.
Publication year - 2002
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.10321
Subject(s) - materials science , composite material , polyester , polycarbonate , adhesion , molding (decorative) , paint adhesion testing
Various plastic films of a melting point above 170°C were selected for IC package in laser marking. These films include: (1) polyacetal, (2) polycarbonate, (3) polyester, and (4) nylon. They are in a form of a homogeneous layer, polymer blend, or multilayer structure. The plastic films were plasma treated and laminated onto the molded compound through transfer molding process. No extra process was introduced except for slight modification of the mold for film placement. The film molded IC package was evaluated in terms of adhesion, laser marking, and thermal and humidity resistance. Design of experiment was employed for the adhesion study. The results indicated that the polymeric material and film thickness were the key parameters affecting film adhesion. Careful selection of the plastic film made it possible for self‐triming during product ejection. Two kinds of plastic films, namely, nylon and polyester, were finalized as laser markable and moldable materials. The laser marking effects of the film‐molded packages were comparatively better than those of the nonfilm‐molded packages. These two films were molded into IC packages and tested for thermal and humidity resistance. The results showed that polyester film‐molded packages exhibited superior reliability in thermal shock tests (1000 cycles) and unbias cooker tests (72 h). © 2002 John Wiley & Sons, Inc. J Appl Polym Sci 84: 758–766, 2002; DOI 10.1002/app.10321