Premium
Improved adhesion property and electromagnetic interference shielding effectiveness of electroless Cu‐plated layer on poly(ethylene terephthalate) by plasma treatment
Author(s) -
Oh Kyung Wha,
Kim Dong Jun,
Kim Seong Hun
Publication year - 2002
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.10272
Subject(s) - materials science , polyethylene terephthalate , chemisorption , x ray photoelectron spectroscopy , surface roughness , adhesion , layer (electronics) , ethylene , electromagnetic shielding , plasma , chemical engineering , composite material , nuclear chemistry , analytical chemistry (journal) , polymer chemistry , organic chemistry , chemistry , adsorption , catalysis , physics , quantum mechanics , engineering
To develop high‐quality electromagnetic interference (EMI) shielding materials, the effect of plasma pretreatment with various gases prior to Cu plating was investigated. Plasma treatment increased the surface roughness in the decreasing order of Ar > O 2 > NH 3 , but adhesion of the Cu layer on poly(ethylene terephthalate) (PET) film increased in the following order of O 2 < Ar < NH 3 , indicating that the appropriate surface roughness and introduction of an affinitive functional group to Pd on the surface of the PET film were key factors for improving adhesion of the Cu layer. As investigated by XPS analysis, plasma treatment with NH 3 produced N atoms on the PET film, which enhances the chemisorption of Pd 2+ on PET film, resulting in improved adhesion and shielding effectiveness of the Cu layer deposited on the Pd‐catalyzed surface, because of the high affinity of Pd 2+ for nitrogen. Comparatively, O 2 plasma treatment allowed the chemisorption of more Sn 2+ than of Pd 2+ due to a lack in the affinity of Pd 2+ for oxygen, resulting in the lowest Pd 3d /Sn 3d ratio; thereby, the lowest EMI–shielding effectiveness (SE) value was obtained. In addition, fairly low adhesion was obtained with Ar plasma‐treated PET, even though the PET surface was significantly etched with Ar plasma, due to introduced oxygen groups on the PET surface. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1369–1379, 2002; DOI 10.1002/app.10272