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Formation of glass transition temperature‐less ( T g ‐less) composite with epoxy resin and ionomer
Author(s) -
Nishida Hirofumi,
Ueda Hisatoshi,
Matsuda Satoshi,
Kishi Hajime,
Murakami Atsushi
Publication year - 2007
Publication title -
asia‐pacific journal of chemical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.348
H-Index - 35
eISSN - 1932-2143
pISSN - 1932-2135
DOI - 10.1002/apj.28
Subject(s) - epoxy , glass transition , curing (chemistry) , ionomer , polymer chemistry , materials science , composite number , composite material , polymerization , diglycidyl ether , dynamic mechanical analysis , drop (telecommunication) , bisphenol a , chemistry , copolymer , polymer , telecommunications , computer science
A T g ‐less epoxy resin was easily obtained by curing with ionomer. In this system, the storage modulus did not drop and maintained a high level as if it were in a glassy state even at an elevated temperature of 300 °C. Investigation of the curing process for the epoxy resin mixture with ionomer, using DSC and FT‐IR, revealed that the curing reaction was initiated from the nucleophilic addition of—COO − to the epoxy group to form an ester linkage, and that the chain propagation subsequently occurred by anionic ring opening polymerization of the epoxy group to form an ether linkage. On the basis of the results, the mechanism of ‘ T g ‐disappearing phenomenon’ is also discussed. Copyright © 2007 Curtin University of Technology and John Wiley & Sons, Ltd.