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Recycled PCB flour reinforced linear low‐density polyethylene composites enhanced by water cross‐linking reaction
Author(s) -
Kuan ChenFeng,
Kuan HsuChiang,
Ma ChenChi M.,
Chen ChiaHsun,
Lin KunChang,
Peng HsinChin
Publication year - 2009
Publication title -
asia‐pacific journal of chemical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.348
H-Index - 35
eISSN - 1932-2143
pISSN - 1932-2135
DOI - 10.1002/apj.191
Subject(s) - wood flour , composite material , materials science , polyolefin , linear low density polyethylene , ultimate tensile strength , composite number , flexural strength , izod impact strength test , polyethylene , scanning electron microscope , heat deflection temperature , layer (electronics)
Recycled printed circuit board (PCB) flour reinforced linear low‐density polyethylene (LLDPE) composites were prepared successfully. Water cross‐linking technique was adopted to improve the physical characteristics of the composites. Composites were compounded using a twin‐screw extruder and treated with a coupling agent (vinyltrimethoxysilane, VTMOS) and a compatibilizer (polyolefin elastomer grafted with melaic acid, POE‐g‐MA). They were then moisture‐cross‐linked in hot water. The composite that was cross‐linked in water exhibited better mechanical properties than the noncross‐linked composite because of strong chemical bonding between the filler and the polyolefin matrix. When the PCB flour content reaches 60 wt% following 4 h of water cross‐linking, the tensile strength and the flexural strength are increased by 18.8% (12.8–15.2 MPa) and 13.2% (21.9–24.8 MPa) respectively. Scanning electron microscopy (SEM) images of the fracture surfaces of water cross‐linked composites indicated that good interfacial strength existed between the filler and the polyolefin matrix. Thermal analyses of water cross‐linked composites indicated that the thermal degradation temperature and the heat deflection temperature (HDT) of the composite increased with the increasing of water cross‐linking time. The HDT of the composite rose from 55.8 to 83 °C. Copyright © 2008 Curtin University of Technology and John Wiley & Sons, Ltd.