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Deposition of crystalline copper films from tetranuclear copper (II) complexes without application of reducing atmosphere
Author(s) -
Shahid Muhammad,
Mazhar Muhammad,
Hamid Mazhar,
O' Brien Paul,
Malik Mohammad A.,
Helliwell Madeleine
Publication year - 2010
Publication title -
applied organometallic chemistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.53
H-Index - 71
eISSN - 1099-0739
pISSN - 0268-2605
DOI - 10.1002/aoc.1672
Subject(s) - copper , chemistry , triclinic crystal system , tetragonal crystal system , crystallinity , yield (engineering) , chemical vapor deposition , crystal structure , crystallography , chemical engineering , inorganic chemistry , metallurgy , organic chemistry , materials science , engineering
Crystalline copper films were deposited by aerosol‐assisted chemical vapor deposition (AACVD) in the absence of hydrogen from two newly synthesized complexes [Cu(deae)(TFA)] 4 ·1.25THF ( 1 ) and [Cu 4 (OAc) 6 (bdmap) 2 (H 2 O) 2 ]·4H 2 O ( 2 ) [deae = N , N ‐diethylaminoethanolate, TFA = trifloroacetate, OAc = acetate and bdmap = 1,3‐bis(dimethylamino)‐2‐propanolato]. These precursors were prepared in high yield using mixed ligands and crystallized in tetragonal and triclinic crystal systems with space groups 14 1 /a and P − 1. Complexes 1 and 2 thermally decomposed at 290 and 250 °C, respectively, to yield copper films which were characterized by SEM/EDX for their morphology and composition and PXRD for their crystallinity and phase. These films have smooth morphologies with particle sizes within the range of 0.3–0.6 µm and may find applications in fabrication of ultralarge‐scale integrated circuits. Copyright © 2010 John Wiley & Sons, Ltd.