Inside Cover: Trimethylaluminum: Bonding by Charge and Current Topology (Angew. Chem. Int. Ed. 46/2015) | Zendy

Stammler HansGeorg | Zendy; Blomeyer Sebastian | Zendy; Berger Raphael J. F. | Zendy; Mitzel Norbert W. | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Premium

Inside Cover: Trimethylaluminum: Bonding by Charge and Current Topology (Angew. Chem. Int. Ed. 46/2015)

Author(s) -

Stammler HansGeorg,

Blomeyer Sebastian,

Berger Raphael J. F.,

Mitzel Norbert W.

Publication year - 2015

Publication title -

angewandte chemie international edition

Language(s) - English

Resource type - Reports

SCImago Journal Rank - 5.831

H-Index - 550

eISSN - 1521-3773

pISSN - 1433-7851

DOI - 10.1002/anie.201509534

Subject(s) - cover (algebra) , topology (electrical circuits) , current (fluid) , plane (geometry) , electron , chemistry , condensed matter physics , physics , materials science , combinatorics , mathematics , engineering , geometry , quantum mechanics , thermodynamics , mechanical engineering

150 years after its discovery by W. Odling the bonding situation in dimeric aluminum trimethyl is still under debate. In their Communication on page 13816 ff., N. Mitzel et al. provide new data from experimentally determined electron density topology (shown in the illustration as bond paths) and calculated magnetic response currents (plane below the molecular graph).

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here

Accelerating Research