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Inside Cover: Trimethylaluminum: Bonding by Charge and Current Topology (Angew. Chem. Int. Ed. 46/2015)
Author(s) -
Stammler HansGeorg,
Blomeyer Sebastian,
Berger Raphael J. F.,
Mitzel Norbert W.
Publication year - 2015
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.201509534
Subject(s) - cover (algebra) , topology (electrical circuits) , current (fluid) , plane (geometry) , electron , chemistry , condensed matter physics , physics , materials science , combinatorics , mathematics , engineering , geometry , quantum mechanics , thermodynamics , mechanical engineering
150 years after its discovery by W. Odling the bonding situation in dimeric aluminum trimethyl is still under debate. In their Communication on page 13816 ff., N. Mitzel et al. provide new data from experimentally determined electron density topology (shown in the illustration as bond paths) and calculated magnetic response currents (plane below the molecular graph).