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Rapid, On‐Command Debonding of Stimuli‐Responsive Cross‐Linked Adhesives by Continuous, Sequential Quinone Methide Elimination Reactions
Author(s) -
Kim Hyungwoo,
Mohapatra Hemakesh,
Phillips Scott T.
Publication year - 2015
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.201506511
Subject(s) - depolymerization , adhesive , materials science , ether , polymer chemistry , quinone , quinone methide , composite material , chemistry , organic chemistry , layer (electronics)
Adhesives that selectively debond from a surface by stimuli‐induced head‐to‐tail continuous depolymerization of poly(benzyl ether) macro‐cross‐linkers within a poly(norbornene) matrix are described. Continuous head‐to‐tail depolymerization provides faster rates of response than can be achieved using a small‐molecule cross‐linker, as well as responses to lower stimulus concentrations. Shear‐stress values for glass held together by the adhesive reach 0.51±0.10 MPa, whereas signal‐induced depolymerization via quinone methide intermediates reduces the shear stress values to 0.05±0.02 MPa. Changing the length of the macro‐cross‐linkers alters the time required for debonding, and thus enables the programmed sequential release of specific layers in a glass composite material.