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Ligand‐Free Copper‐Catalyzed Negishi Coupling of Alkyl‐, Aryl‐, and Alkynylzinc Reagents with Heteroaryl Iodides
Author(s) -
Thapa Surendra,
Kafle Arjun,
Gurung Santosh K.,
Montoya Adam,
Riedel Patrick,
Giri Ramesh
Publication year - 2015
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.201502379
Subject(s) - negishi coupling , aryl , alkyl , ligand (biochemistry) , reagent , catalysis , chemistry , combinatorial chemistry , copper , coupling (piping) , organic chemistry , materials science , receptor , biochemistry , metallurgy
Reported herein is an unprecedented ligand‐free copper‐catalyzed cross‐coupling of alkyl‐, aryl‐, and alkynylzinc reagents with heteroaryl iodides. The reaction proceeds at room temperature for the coupling of primary, secondary, and tertiary alkylzinc reagents with heteroaryl iodides without rearrangement. An elevated temperature (100 °C) is required for aryl–heteroaryl and alkynyl–heteroaryl couplings.