Premium
Back Cover: Stabilization of Copper Catalysts for Liquid‐Phase Reactions by Atomic Layer Deposition (Angew. Chem. Int. Ed. 51/2013)
Author(s) -
O'Neill Brandon J.,
Jackson David H. K.,
Crisci Anthony J.,
Farberow Carrie A.,
Shi Fengyuan,
AlbaRubio Ana C.,
Lu Junling,
Dietrich Paul J.,
Gu Xiangkui,
Marshall Christopher L.,
Stair Peter C.,
Elam Jeffrey W.,
Miller Jeffrey T.,
Ribeiro Fabio H.,
Voyles Paul M.,
Greeley Jeffrey,
Mavrikakis Manos,
Scott Susannah L.,
Kuech Thomas F.,
Dumesic James A.
Publication year - 2013
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.201309934
Subject(s) - catalysis , atomic layer deposition , copper , layer (electronics) , liquid phase , deposition (geology) , phase (matter) , metal , nanoparticle , coating , chemical engineering , materials science , cover (algebra) , nanotechnology , chemistry , metallurgy , organic chemistry , physics , engineering , paleontology , sediment , biology , thermodynamics , mechanical engineering
Deactivation of heterogeneous catalysts is an important issue in liquid‐phase catalytic processes and for the utilization of base metal catalysts, such as copper. In their Communication on page 13808 ff., J. A. Dumesic et al. show that atomic layer deposition can be used to build a protective coating around metallic nanoparticles, thereby preventing irreversible catalyst deactivation during liquid‐phase catalytic processing.