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Reliable Metal Deposition into TiO 2 Nanotubes for Leakage‐Free Interdigitated Electrode Structures and Use as a Memristive Electrode
Author(s) -
Liu Ning,
Lee Kiyoung,
Schmuki Patrik
Publication year - 2013
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.201306334
Subject(s) - electrode , materials science , coalescence (physics) , nanotechnology , deposition (geology) , leakage (economics) , metal , optoelectronics , chemistry , metallurgy , macroeconomics , economics , paleontology , physics , sediment , astrobiology , biology
Nearly 100 % filling of TiO 2 nanotubes with metals, including Ag, Cu, Au, and Pt, was achieved by defect‐sealing treatment at the bottom of the nanotubes, followed by metal deposition using nuclei formation/coalescence. The resulting short‐circuit‐free interdigitated electrode configurations can, for example, be used to fabricate memristive electrodes.