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A Supramolecular Hydrogen‐Bonded Network as a Diffusion Barrier for Metal Adatoms
Author(s) -
Silien Christophe,
Räisänen Minna T.,
Buck Manfred
Publication year - 2009
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.200806267
Subject(s) - monolayer , supramolecular chemistry , underpotential deposition , deposition (geology) , copper , diffusion , diffusion barrier , chemistry , self assembled monolayer , hydrogen , metal , chemical physics , materials science , crystallography , electrode , electrochemistry , nanotechnology , layer (electronics) , cyclic voltammetry , crystal structure , organic chemistry , thermodynamics , paleontology , physics , sediment , biology
Confined in a molecular corral : A supramolecular network changes the mechanism by which underpotential deposition (UPD) of copper proceeds on a gold electrode modified by a self‐assembled monolayer (SAM). Lateral diffusion of Cu adatoms is suppressed between adjacent cells of a network/SAM hybrid structure. Instead, UPD occurs by direct deposition into the SAM filled pores of the network, where the Cu adatoms are confined.