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Semiconductor Wires and Ribbons for High‐ Performance Flexible Electronics
Author(s) -
Baca Alfred J.,
Ahn JongHyun,
Sun Yugang,
Meitl Matthew A.,
Menard Etienne,
Kim HoonSik,
Choi Won Mook,
Kim DaeHyeong,
Huang Young,
Rogers John A.
Publication year - 2008
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.200703238
Subject(s) - fabrication , electronics , materials science , semiconductor , electronic circuit , transistor , nanotechnology , flexible electronics , electronic materials , semiconductor materials , semiconductor device , engineering physics , optoelectronics , electrical engineering , engineering , voltage , pathology , layer (electronics) , medicine , alternative medicine
This article reviews the properties, fabrication and assembly of inorganic semiconductor materials that can be used as active building blocks to form high‐performance transistors and circuits for flexible and bendable large‐area electronics. Obtaining high performance on low temperature polymeric substrates represents a technical challenge for macroelectronics. Therefore, the fabrication of high quality inorganic materials in the form of wires, ribbons, membranes, sheets, and bars formed by bottom‐up and top‐down approaches, and the assembly strategies used to deposit these thin films onto plastic substrates will be emphasized. Substantial progress has been made in creating inorganic semiconducting materials that are stretchable and bendable, and the description of the mechanics of these form factors will be presented, including circuits in three‐dimensional layouts. Finally, future directions and promising areas of research will be described.