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The Hydrophobic Effect as a Driving Force in the Self‐Assembly of a [2×2] Copper( I ) Grid
Author(s) -
Nitschke Jonathan R.,
Hutin Marie,
Bernardinelli Gérald
Publication year - 2004
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.200461308
Subject(s) - copper , grid , chemistry , materials science , metallurgy , mathematics , geometry
Spring‐loaded supramolecular chemistry: Pyridine‐2‐carboxaldehyde reacts with the m ‐phenylenediamine shown in aqueous solution in the presence of Cu I ions to give a tetracopper( I ) grid complex (see structure). This structure is stable in water, but not in any of the organic solvents tried. The strain incorporated into the structure is compensated by a diffuse pressure applied by the hydrophobic effect. R=2‐hydroxyethylcarbamoyl.
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