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Self‐Assembly of a Cu 4 Complex with Coplanar Copper( I ) Ions: Synthesis, Structure, and Electrochemical Properties
Author(s) -
Youinou MarieThérèse,
Rahmouni Noureddine,
Fischer Jean,
Osborn John A.
Publication year - 1992
Publication title -
angewandte chemie international edition in english
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 0570-0833
DOI - 10.1002/anie.199207331
Subject(s) - pyridazine , crystallography , stacking , rhombus , copper , ion , tetrahedron , chemistry , electrochemistry , pyridine , planar , atom (system on chip) , stereochemistry , electrode , medicinal chemistry , mathematics , geometry , organic chemistry , computer science , computer graphics (images) , embedded system
π‐Stacking interactions in the nearly parallel 3,6‐bis(2‐pyridyl)‐pyridazine (dppn) ligands probably account for the distortion of the planar Cu 4 unit in 1 from a square to a rhombus. Each Cu atom is surrounded in a tetrahedral fashion by two N atoms from pyridine and two N atoms from pyridazine units; the chelate rings themselves are planar. The distance between the pairs of dppn ligands is 3.47 Å.