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Phosphane‐Stabilized Cu I and Ag I Silanes
Author(s) -
Cowley Alan H.,
Elkins Tammy M.,
Jones Richard A.,
Nunn Christine M.
Publication year - 1988
Publication title -
angewandte chemie international edition in english
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 0570-0833
DOI - 10.1002/anie.198813491
Subject(s) - silanes , yield (engineering) , chemistry , crystallography , medicinal chemistry , stereochemistry , materials science , organic chemistry , silane , composite material
The CuSi bond in 1a is 2.34 Å long; 1a is the first neutral compound containing this structural element. Compound 1a is formed in 65% yield by reaction of CuCl with Ph 3 SiLi and Me 3 P (1:1:3) in THF. Compound 1b , the first compound with an AgSi bond, can be prepared in a similar way.