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Chemical Nickel Plating
Author(s) -
Niederprüm Hans
Publication year - 1975
Publication title -
angewandte chemie international edition in english
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 0570-0833
DOI - 10.1002/anie.197506141
Subject(s) - electroplating , metallizing , plating (geology) , metallurgy , nickel , materials science , corrosion , metal , cathodic protection , deposition (geology) , nanotechnology , electrochemistry , chemistry , electrode , layer (electronics) , geophysics , geology , paleontology , sediment , biology
Metal layers can be deposited from aqueous solutions not only by electric current as in electroplating but also by strong reducing agents. Chemical deposition of nickel on metallic and nonmetallic substrates, together with the long‐known silvering of glass, are the most widespread examples. This remarkable reaction has recently found a variety of industrial applications mainly in the preparation of corrosion‐resistant, hard, and wear‐resistant protective layers, in the metallizing of plastics, and in electronics.