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Dry Sintering Meets Wet Silver‐Ion “Soldering”: Charge‐Transfer Plasmon Engineering of Solution‐Assembled Gold Nanodimers From Visible to Near‐Infrared I and II Regions
Author(s) -
Fang Lingling,
Wang Yueliang,
Liu Miao,
Gong Ming,
Xu An,
Deng Zhaoxiang
Publication year - 2016
Publication title -
angewandte chemie
Language(s) - English
Resource type - Journals
eISSN - 1521-3757
pISSN - 0044-8249
DOI - 10.1002/ange.201608271
Subject(s) - plasmon , materials science , surface plasmon resonance , sintering , nanomaterials , soldering , nanotechnology , chemical engineering , nanoparticle , optoelectronics , metallurgy , engineering
Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self‐assembly process capable of producing highly uniform and solution‐processable nanomaterials with tailor‐made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag + soldering and dry thermal sintering to produce nanodimer‐derived structures with precisely engineered charge‐transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA‐linked AuNP dimers toward plasmonic meta‐materials via DNA‐guided soldering and sintering.