z-logo
Premium
Electron‐electron interactions and the metal‐insulator transition in heavily doped silicon
Author(s) -
v. Löhneysen H.
Publication year - 2011
Publication title -
annalen der physik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.009
H-Index - 68
eISSN - 1521-3889
pISSN - 0003-3804
DOI - 10.1002/andp.201100034
Subject(s) - condensed matter physics , electron , coulomb , metal–insulator transition , doping , materials science , scaling , semiconductor , exponent , conductivity , hubbard model , critical exponent , metal , physics , phase transition , superconductivity , quantum mechanics , linguistics , philosophy , geometry , mathematics , optoelectronics , metallurgy
The metal‐insulator (MI) transition in Si:P can be tuned by varying the P concentration or – for barely insulating samples – by application of uniaxial stress S. On‐site Coulomb interactions lead to the formation of localized magnetic moments and the Kondo effect on the metallic side, and to a Hubbard splitting of the donor band on the insulating side. Continuous stress tuning allows the observation of finite‐temperature dynamic scaling of σ (T,S) and hence a reliable determination of the critical exponent μ of the extrapolated zero‐temperature conductivity σ (0) ∼ | S ‐ S c | μ , i.e., μ = 1, and of the dynamical exponent z = 3. The issue of half‐filling vs. away from half‐filling of the donor band (i.e., uncompensated vs. compensated semiconductors) is discussed in detail.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here