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Panel movement effects on solution flow in through‐holes of printed circuit panels
Author(s) -
Galasco R. T.,
David A. P.,
Shaffer R. R.
Publication year - 1987
Publication title -
aiche journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.958
H-Index - 167
eISSN - 1547-5905
pISSN - 0001-1541
DOI - 10.1002/aic.690330605
Subject(s) - movement (music) , flow (mathematics) , mechanics , process (computing) , printed circuit board , mechanical engineering , engineering , materials science , acoustics , computer science , physics , electrical engineering , operating system
A hydrodynamic model is developed relating the movement of printed circuit panels to solution flow in through‐holes. Qualitative and quantitative model verification is experimentally established. Effects of external gas bubbling on hole solution transport are elucidated. Based on the hydrodynamic model, panel motion criteria for contamination‐free and fast chemical processing are introduced. Limits of mechanical panel movement as a method for processing holes of different geometry with typical wet chemical process baths are addressed.