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Adjusting accommodation microenvironment for Cu + to enhance oxidation inhibition for thiophene capture
Author(s) -
Li YuXia,
Jin MengMeng,
Shi Shu,
Qi ShiChao,
Liu XiaoQin,
Sun LinBing
Publication year - 2021
Publication title -
aiche journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.958
H-Index - 167
eISSN - 1547-5905
pISSN - 0001-1541
DOI - 10.1002/aic.17368
Subject(s) - adsorption , moisture , flue gas desulfurization , thiophene , mesoporous material , chemistry , copper , chemical engineering , coating , mesoporous silica , zeolite , polydimethylsiloxane , carbon fibers , oxygen , inorganic chemistry , materials science , catalysis , organic chemistry , composite material , composite number , engineering
Cu + ‐containing materials have great potentials in various applications like adsorptive desulfurization. Nevertheless, their applications are severely obstructed by poor stability of Cu + in air. Here, we first clarify the mechanism of Cu + oxidation by first‐principle calculations and demonstrate that moisture accelerates Cu + oxidation dramatically. Then, the microenvironment of Cu 2 O‐modified HKUST‐1, a typical metal‐organic framework, is adjusted from hydrophilic to hydrophobic with polydimethylsiloxane coating (producing Cu 2 O@HK@P). This isolates moisture from pores and enhances the stability of Cu + significantly even under oxygen atmosphere. Cu + in Cu 2 O@HK@P preserves well after exposed to air for 6 months, while Cu 2 O@HK lose almost all Cu + for 2 weeks. The optimal Cu 2 O@HK@P can remove 540 μmol g −1 of thiophene from hydrous fuel, which is much superior to Cu 2 O@HK (227 μmol g −1 ) and most reported adsorbents. Our strategy can also be applied to stabilize Cu + in various materials including zeolite, mesoporous silica, and activated carbon.