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Utilizing yield‐stress fluids to suppress chaining during magnetic alignment of microdisks via rotating fields
Author(s) -
Tan Mingyang,
Lambert Adam L.,
Swann Britany M.,
Song Han,
Dhagat Pallavi,
Jander Albrecht,
Walker Travis W.
Publication year - 2018
Publication title -
aiche journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.958
H-Index - 167
eISSN - 1547-5905
pISSN - 0001-1541
DOI - 10.1002/aic.16215
Subject(s) - yield (engineering) , magnetic field , particle (ecology) , materials science , chaining , magnetic nanoparticles , anisotropy , magnetic particle inspection , stress (linguistics) , magnetic anisotropy , field (mathematics) , composite material , nanotechnology , chemical physics , condensed matter physics , mechanics , optics , physics , magnetization , nanoparticle , psychology , linguistics , oceanography , philosophy , mathematics , quantum mechanics , pure mathematics , psychotherapist , geology
Inkjet printing can be used to deposit photopolymerizable magnetic inks for the creation of functionalized composites. Anisotropic properties in the composites can be achieved when inkjet printing is combined with external magnetic fields to align magnetically orientable particles (MOPs). When a MOP is induced by an external magnetic field, it will create its own magnetic field that can attract neighboring particles. The coarsening of particles into higher‐order structures like chains and sheets is unwanted in certain areas, such as high‐frequency applications. We show that this particle–particle attraction and subsequent particle migration can be inhibited with the introduction of a yield stress into the suspending medium, while still allowing the alignment of the particle to proceed. For magnetically induced rotational and translational motions for oblate spheroids in a rotating magnetic field, theoretical scalings are presented for the characteristic timescales in a linear fluid and for the characteristic stresses in a yield‐stress fluid. © 2018 American Institute of Chemical Engineers AIChE J , 64: 3215–3226, 2018