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Engineering materials layer‐by‐layer: Challenges and opportunities in multilayer assembly
Author(s) -
Hammond Paula T.
Publication year - 2011
Publication title -
aiche journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.958
H-Index - 167
eISSN - 1547-5905
pISSN - 0001-1541
DOI - 10.1002/aic.12769
Subject(s) - layer (electronics) , layer by layer , materials science , nanotechnology , process engineering , engineering