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Mass and heat transfer modeling of a physical vapor deposition effusion source
Author(s) -
Junker S. Tobias,
Birkmire Robert W.,
Doyle Francis J.
Publication year - 2005
Publication title -
aiche journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.958
H-Index - 167
eISSN - 1547-5905
pISSN - 0001-1541
DOI - 10.1002/aic.10331
Subject(s) - mass transfer , effusion , heat transfer , flow (mathematics) , energy balance , deposition (geology) , volumetric flow rate , process (computing) , mass flow , mechanics , process engineering , materials science , computer science , thermodynamics , engineering , physics , paleontology , sediment , biology , operating system
The effusion sources modeled in this article are part of a continuous process for production of thin‐film photovoltaic modules. Industrial production requires tight control of the vapor flow rates during long run times. A dynamic model is developed to provide physical insight, facilitate simulation studies, and to be incorporated into model‐based control schemes. Prediction of the vapor flow rate requires both the mass and energy balance to be solved. Model parameters are estimated based on literature and experimental data, and the entire model is shown to be consistent with independent experimental data. © 2005 American Institute of Chemical Engineers AIChE J, 51: 878–894, 2005