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Scaling Printable Zn–Ag 2 O Batteries for Integrated Electronics
Author(s) -
Kumar Rajan,
Johnson Kevin M.,
Williams Nicholas X.,
Subramanian Vivek
Publication year - 2019
Publication title -
advanced energy materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.08
H-Index - 220
eISSN - 1614-6840
pISSN - 1614-6832
DOI - 10.1002/aenm.201803645
Subject(s) - battery (electricity) , materials science , fabrication , energy storage , electronics , electrode , nanotechnology , voltage , optoelectronics , printed electronics , electrical engineering , small form factor , power (physics) , engineering , medicine , chemistry , physics , alternative medicine , pathology , quantum mechanics
Printed batteries are an emerging solution for integrated energy storage using low‐cost, high accuracy fabrication techniques. While several printed batteries have been previously shown, few have designed a battery that can be incorporated into an integrated device. Specifically, a fully printed battery with a small active electrode area (<1 cm 2 ) achieving high areal capacities (>10 mAh cm −2 ) at high current densities (1–10 mA cm −2 ) has not been demonstrated, which represents the minimum form‐factor and performance requirements for many low‐power device applications. This work addresses these challenges by investigating the scaling limits of a fully printed Zn–Ag 2 O battery and determining the electrochemical limitations for a mm 2 ‐scale battery. Processed entirely in air, Zn–Ag 2 O batteries are well suited for integration in typical semiconductor packaging flows compared to lithium‐based chemistries. Printed cells with electrodes as small as 1 mm 2 maintain steady operating voltages above (>1.4 V) at high current densities (1–12 mA cm −2 ) and achieve the highest reported areal capacity for a fully printed battery at 11 mAh cm −2 . The findings represent the first demonstration of a small, packaged, fully printed Zn–Ag 2 O battery with high areal capacities at high current densities, a crucial step toward realizing chip‐scale energy storage for integrated electronic systems.