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Highly Efficient Tandem Organic Solar Cell Enabled by Environmentally Friendly Solvent Processed Polymeric Interconnecting Layer
Author(s) -
Zhang Kai,
Fan Baobing,
Xia Ruoxi,
Liu Xiang,
Hu Zhicheng,
Gu Honggang,
Liu Shiyuan,
Yip HinLap,
Ying Lei,
Huang Fei,
Cao Yong
Publication year - 2018
Publication title -
advanced energy materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.08
H-Index - 220
eISSN - 1614-6840
pISSN - 1614-6832
DOI - 10.1002/aenm.201703180
Subject(s) - tandem , pedot:pss , materials science , environmentally friendly , organic solar cell , active layer , energy conversion efficiency , photoactive layer , fabrication , nanotechnology , layer (electronics) , polymer , chemical engineering , optoelectronics , composite material , ecology , engineering , biology , medicine , thin film transistor , alternative medicine , pathology
In the field of organic solar cells (OSCs), tandem structure devices exhibit very attractive advantages for improving power conversion efficiency (PCE). In addition to the well researched novel pair of active layers in different subcells, the construction of interconnecting layer (ICL) also plays a critical role in achieving high performance tandem devices. In this work, a new way of achieving environmentally friendly solvent processed polymeric ICL by adopting poly[(9,9‐bis(3′‐( N,N ‐dimethylamino)propyl)‐2,7‐fluorene)‐alt‐5,5′‐bis(2,2′‐thiophene)‐2,6‐naphthalene‐1,4,5,8‐tetracaboxylic‐ N,N ′‐di(2‐ethylhexyl)imide] (PNDIT‐F3N) blended with poly(ethyleneimine) (PEI) as the electron transport layer (ETL) and PEDOT:PSS as the hole transport layer is reported. It is found that the modification ability of PNDIT‐F3N on PEDOT can be linearly tuned by the incorporation of PEI, which offers the opportunity to study the charge recombination behavior in ICL. At last, tandem OSC with highest PCE of 12.6% is achieved, which is one of the best tandem OSCs reported till now. These results offer a new selection for constructing efficient ICL in high performance tandem OSCs and guide the way of design new ETL materials for ICL construction, and may even be integrated in future printed flexible large area module device fabrication with the advantages of environmentally friendly solvent processing and thickness insensitivity.