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Ultrasmall Integrated 3D Micro‐Supercapacitors Solve Energy Storage for Miniature Devices
Author(s) -
Meng Chuizhou,
Maeng Jimin,
John Simon W. M.,
Irazoqui Pedro P.
Publication year - 2014
Publication title -
advanced energy materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.08
H-Index - 220
eISSN - 1614-6840
pISSN - 1614-6832
DOI - 10.1002/aenm.201301269
Subject(s) - supercapacitor , energy storage , nanotechnology , electronics , materials science , fabrication , computer data storage , computer science , power (physics) , electrical engineering , computer hardware , electrode , capacitance , engineering , medicine , chemistry , physics , alternative medicine , quantum mechanics , pathology
A novel integrated 3D micro‐supercapacitor is reported . A through‐via bottom electrode technique is utilized for the first time for supercapacitor fabrication, and a highly miniaturized, flexible, and all‐solid‐state micro‐supercapacitor with 3D integration capability is achieved. Module‐wise compact integration of supercapacitors and their versatile powering applications are demonstrated. This device enables high‐power energy storage in small‐scale electronics.