Premium
Magnetic‐Sensitive Crack Sensor with Ultrahigh Sensitivity at Room Temperature by Depositing Graphene Nanosheets upon a Flexible Magnetic Film
Author(s) -
Huang Jianyu,
Ma Zheng,
Wu Zhenhua,
Peng Linghui,
Su Bin
Publication year - 2021
Publication title -
advanced electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.25
H-Index - 56
ISSN - 2199-160X
DOI - 10.1002/aelm.202100335
Subject(s) - graphene , materials science , magnetic field , sensitivity (control systems) , optoelectronics , nanotechnology , signal (programming language) , electronics , electrical engineering , electronic engineering , computer science , physics , quantum mechanics , engineering , programming language
Flexible magnetic field sensors attract significant interests in magnetic detection and flexible electronics. However, two challenges, low sensitivity, and limited working range, impede their practical application. Herein, a new type of magnetic‐sensitive crack sensor (M‐CS) by depositing graphene nanosheets upon a flexible magnetic film through a facial infrared drying technique is reported. The M‐CS exhibits an ultrahigh sensitivity (relative resistance change up to 4.0 × 10 10 ) toward a moderate magnetic field of 43 mT at room temperature. In addition, the M‐CS shows a long cycling stability over 10 000 cycles. Such a superior sensitivity is attributed to physically cutting/recovering the pathways of electron transport through nanosheets’ separation/contact. Diverse experimental parameters, such as the concentration of graphene solution and the thickness of bottom magnetic substrates, have been tailored to improve the magnetic sensitivity of M‐CS. Furthermore, the array of M‐CSs with different relative resistance change can be used as the cipher key to recognize aimed magnetic signal without contact. It is believed that the M‐CS with an ultrahigh magnetic sensitivity at operational condition and long‐term stability could benefit the development of magneto‐sensitive sensors, and exploit the application of 2D materials in flexible electronic devices.