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Toward Wafer‐Scale Production of 2D Transition Metal Chalcogenides
Author(s) -
Wang Peijian,
Yang Deren,
Pi Xiaodong
Publication year - 2021
Publication title -
advanced electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.25
H-Index - 56
ISSN - 2199-160X
DOI - 10.1002/aelm.202100278
Subject(s) - materials science , nanotechnology , chemical vapor deposition , wafer , electronics , layer (electronics) , deposition (geology) , engineering , electrical engineering , paleontology , sediment , biology
2D transition metal chalcogenides (TMCs) have attracted tremendous interest from both the scientific and technological communities due to their variety of properties and superior tunability through layer number, composition, and interface engineering. Wafer‐scale production of 2D TMCs is critical to the industrial applications of these materials. Extensive efforts have been bestowed to the large‐area growth of 2D TMCs through various approaches. In this review, recent advances in obtaining large‐area 2D TMCs by different methods such as chemical vapor deposition (CVD), metal–organic CVD, and physical vapor deposition are first highlighted and their advantages and disadvantages are also evaluated. Then, strategies for the control of the grains, morphology, layer number, and phase to achieve controllable and uniform thicknesses and large crystal domains for 2D TMCs are discussed. Applications of large‐area 2D TMCs in electronics, optoelectronics, spintronics, etc., are also introduced. Finally, ideas and prospects for the future developments of wafer‐scale 2D TMCs are provided.