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Boron Nitride Nanotube Coatings for Thermal Management of Printed Silver Inks on Temperature Sensitive Substrates
Author(s) -
Wagner Kaitlin,
Paquet Chantal,
MartinezRubi Yadienka,
Genest Marc,
Guan Jingwen,
Sampson Kathleen L.,
Kim Keun Su,
Kell Arnold J.,
Malenfant Patrick R. L.,
Lessard Benoît H.
Publication year - 2021
Publication title -
advanced electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.25
H-Index - 56
ISSN - 2199-160X
DOI - 10.1002/aelm.202001035
Subject(s) - materials science , printed electronics , sintering , boron nitride , substrate (aquarium) , screen printing , electrical conductor , nanotechnology , conductive ink , thin film , composite material , optoelectronics , sheet resistance , inkwell , layer (electronics) , oceanography , geology
Printed electronics provide inexpensive and light weight electrical components to fuel emerging applications. One major challenge is the high temperature required to sinter conductive metal inks, which leads to thermal degradation of the substrate and subsequently poor performance. A boron nitride nanotube (BNNT) interfacial film is reported for thermal management in rapid processing of a printable silver molecular ink platform using intense pulsed light (IPL) sintering techniques. The inclusion of BNNT thin films of varying surface concentrations deposited between the substrate and the printed features reduces thermal damage to the substrate during sintering while simultaneously improving electrical performance, achieving a sheet resistance value as low as 140 mΩ sq −1 . A wide range of sintering energies ranging from 2.0 and 3.2 J cm −2 are investigated along with printed trace widths ranging from 5 mil (0.127 mm) to 20 mil (0.508 mm). Increases in the rate of cooling and in the current carrying capacity are confirmed with the inclusion of the BNNTs. Overall the thin coating of BNNTs presents no drawbacks while significantly improving the electrical properties of IPL sintered conductive traces and thus represents a simple approach that will advance the adoption of IPL for fabricating printed electronic components.