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Multifunctional Graphene Composites for Electromagnetic Shielding and Thermal Management at Elevated Temperatures
Author(s) -
Barani Zahra,
Kargar Fariborz,
Mohammadzadeh Amirmahdi,
Naghibi Sahar,
Lo Carissa,
Rivera Brandon,
Balandin Alexander A.
Publication year - 2020
Publication title -
advanced electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.25
H-Index - 56
ISSN - 2199-160X
DOI - 10.1002/aelm.202000520
Subject(s) - materials science , electromagnetic shielding , emi , graphene , composite material , thermal conduction , thermal conductivity , electromagnetic interference , epoxy , microwave , electronic engineering , nanotechnology , telecommunications , computer science , engineering
A method for scalable synthesis of epoxy composites with graphene and few‐layer graphene fillers is described, and the electromagnetic interference (EMI) shielding and thermal properties of such composites at elevated temperatures are reported. The tested materials reveal excellent total EMI shielding of SE T ≈ 65 dB (≈ 105 dB) at a thickness of 1 mm (≈ 2 mm) in the X‐band frequency range. At higher filler loading fractions, composites reveal a room‐temperature cross‐plane thermal conductivity of 11.2 ± 0.9 Wm −1 K −1 , which is a factor of ×41 larger than that of the pristine epoxy. Interestingly, the EMI shielding efficiency improves further as the temperature increases while the thermal conductivity remains approximately constant. The enhancement in the EMI shielding is explained by the temperature dependence of the two electrical conduction mechanisms, electronic band‐type conduction inside the fillers, and hopping conduction between the fillers. The excellent EMI shielding and heat conduction characteristics of such multifunctional graphene composites at high temperatures are promising for packaging applications of microwave components where EMI shielding and thermal management are important design considerations.