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Flexible Thermoelectric Double‐Layer Inorganic/Organic Composites Synthesized by Additive Manufacturing
Author(s) -
Du Yong,
Chen Jiageng,
Meng Qiufeng,
Xu Jiayue,
Lu Jun,
Paul Biplab,
Eklund Per
Publication year - 2020
Publication title -
advanced electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.25
H-Index - 56
ISSN - 2199-160X
DOI - 10.1002/aelm.202000214
Subject(s) - seebeck coefficient , materials science , thermoelectric effect , composite material , composite number , electrical resistivity and conductivity , layer (electronics) , thermoelectric materials , fabrication , thermal conductivity , electrical engineering , medicine , physics , alternative medicine , pathology , thermodynamics , engineering
This study shows an approach to combine a high electrical conductivity of one composite layer with a high Seebeck coefficient of another composite layer in a double‐layer composite, resulting in high thermoelectric power factor. Flexible double‐layer‐composites, made from Bi 2 Te 3 ‐based‐alloy/polylactic acid (BTBA/PLA) composites and Ag/PLA composites, are synthesized by solution additive manufacturing. With the increase in Ag volume‐ratio from 26.3% to 41.7% in Ag/PLA layers, the conductivity of the double‐layer composites increases from 12 S cm −1 to 1170 S cm −1 , while the Seebeck coefficient remains ≈80 μV K −1 at 300 K. With further increase in volume ratio of Ag until 45.6% in Ag/PLA composite layer, the electrical conductivity of the double‐layer composites increases to 1710 S cm −1 , however, with a slight decrease of the Seebeck coefficient to 64 μV K −1 . The electrical conductivity and Seebeck coefficient vary only to a limited extent with the temperature. The high Seebeck coefficient is due to scattering of low energy charge carriers across compositionally graded interfaces. A power factor of 875 μW m −1 K −2 is achieved at 360 K for 41.7 vol.% Ag in the Ag/PLA layers. Solution additive manufacturing can directly print this double‐layer composite into intricate geometries, making this process is promising for large‐scale fabrication of thermoelectric composites.